Composite Lab
This laboratory is established to carry out the research works in the area of materials science. It enables the students and faculty members to do the project works related to polymer and metal matrix composites. It consists of many equipments which is given below with the detailed specifications.
Specifications

Specifications:
Operating temperature -1650 degree C,
Internal dimension -366 mm x 367 mm x 386 mm,
Hot zone size -50 mm x 50 mm x 50 mm,
Magnetron operating system - Auto/Manual
Purpose:
- Sintering of metal and ceramic components
- Heat treatment of alloys

Specifications:
Working temperature - 1200 degree C
Heating rate - 10 degree C
Temperature controller - PID
Thermocouple - K type
Accuracy - ±1 degree C
Purpose:
- Melting and sintering of metal components
- Heat treatment of alloys

Specifications:
Maximum temperature -300 degree C
Working temperature - 250 degree C
Inside volume -450x450x450 mm
Temperature controller -Digital PID controller
Purpose:
- Drying, baking and conditioning the various materials

Specifications:
Tungsten carbide Grinding bowl - 250 ml volume
Tungsten carbide 10 mm ball -50 numbers
Tungsten carbide 5 mm ball -100 numbers
Purpose:
- Grinding and blending of various powder
- Mechanical alloying

Specifications:
Capacity – 150 ton
Platen size – 500 mm x 500 mm
Stroke length – 250 mm
Platen thickness – 80 to 90 mm
Maximum operating pressure – 200 bar
Maximum operating temperature – 300 degree C
Approach speed – 15-20 mm/sec
Pressing speed – 1-2 mm/sec
Purpose:
- Preparation of advance fibre reinforced polymer composites

Specifications:
AE Input - 1 Channel per USB node
Sampling Frequency - 20 MHz
AE Digitizing - 18 bits
Parametric Inputs - CH 1, +/- 10V, 16 bits CH 2-4, 0-10V, 16 bits
Digital I/O -2
Preamplifier - Built-in
Case Size - L5.25” x W3.25” x H1.25” (133 x 83 x 32mm)
Weight - 0.5 lbs. (0.23kg)
Purpose:
- Identifying the failure mechanism characterization of the materials during testing and machining.
Specifications:
Working temperature – 1200 degree C
Heating rate – 10 degree C
Temperature controller – PID
Thermocouple – K type
Accuracy – ±1 degree C
Purpose:
- Melting and sintering of metal components
- Heat treatment of alloys

Specifications:
Maximum temperature -300 degree C
Working temperature – 250 degree C
Inside volume -450x450x450 mm
Temperature controller -Digital PID controller
Purpose:
- Drying, baking and conditioning the various materials

Specifications:
Tungsten carbide Grinding bowl – 250 ml volume
Tungsten carbide 10 mm ball -50 numbers
Tungsten carbide 5 mm ball -100 numbers
Purpose:
- Grinding and blending of various powder
- Mechanical alloying

Specifications:
Capacity – 150 ton
Platen size – 500 mm x 500 mm
Stroke length – 250 mm
Platen thickness – 80 to 90 mm
Maximum operating pressure – 200 bar
Maximum operating temperature – 300 degree C
Approach speed – 15-20 mm/sec
Pressing speed – 1-2 mm/sec
Purpose:
- Preparation of advance fibre reinforced polymer composites

Specifications:
AE Input – 1 Channel per USB node
Sampling Frequency – 20 MHz
AE Digitizing – 18 bits
Parametric Inputs – CH 1, +/- 10V, 16 bits CH 2-4, 0-10V, 16 bits
Digital I/O -2
Preamplifier – Built-in
Case Size – L5.25” x W3.25” x H1.25” (133 x 83 x 32mm)
Weight – 0.5 lbs. (0.23kg)
Purpose:
- Identifying the failure mechanism characterization of the materials during testing and machining.


