Dr. Prabhakar Subrahmanyam is a Senior Staff Scientist / Distinguished Engineer at Dell Technologies, where he leads advancements in server and rack-level thermal management and AI-and ML-driven thermal optimization for data center ecosystems. Previously, he served as a Staff Scientist at Intel, focusing on thermal research and cooling techniques for microprocessors and GPUs – spanning client devices, desktops, Xeon servers, HPC, and graphics ecosystems. As Chief Thermal Architect for Intel’s advanced node processors, he played a pivotal role in delivering the first exascale computing chip, Ponte Vecchio, for Argonne National Lab and the private sector.

He spearheaded research and innovation in cooling and packaging, driving advancements in photolithography processes for Intel’s processors and GPU roadmap. Dr. Prabhakar holds a degree in Aerospace Engineering from Stanford University, specializing in Hypersonic Aerothermodynamics & atmospheric entry heat transfer for planetary entry probes and vehicles. With over 65 publications and over 50 patents, and several pending at the patent office, he is a pioneering technologist renowned for his expertise in jet impingement cooling techniques for high-power density electronics and innovations in heat exchangers. At Intel Labs, he invented, developed, and deployed numerous innovative cooling solutions that shaped the industry. Prior to Intel, he worked at NASA Ames Research Center on thermal protection systems heat shields for planetary entry probes.

Dr. Prabhakar has delivered over 150 invited talks across universities and industries in several countries. He was instrumental in starting the Center of Excellence for Electronic Cooling lab at SRMIST and SRMAP. He is an active contributor to technical conferences, serving as a session chair, track chair and reviewer for IEEE Transactions on Components, Packaging, and Manufacturing Technology, as well as ASME Transactions on the Journal of Electronic Packaging. His expertise extends from semiconductor thermal management to embedded systems, thermal management in data centers, and emerging technologies such as quantum computing, where advanced cooling solutions are essential for the next-generation computing infrastructure.